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Capabilities
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Thick Film Hybrid Microcircuits
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- Full in-house design and prototype capability for design, development and manufacture of custom–built thick film hybrid microcircuits for aerospace, automotive and other high-reliability application.
- Production of small to large volumes of different product-mix.
- Passive and activelaser trimming.
- Resistor tolerances down to 0.5% and 0.25% (ratio).
- Temperature coefficient of resistance (TCR) 100 ppm/degree Celsius or better.
- Thick film resistance range: 1 ohm to 200 Mohm
- Minimum conductor width: 4mil
- Maximum size of hybrid substrate: 4”x4"
- Conductor materials: PdAg , Au, Ag
- Multilayer HMC upto 4 layers.
- Package: Durez coating, Gold and Nickel plated Hermetically sealed sealed package.
- Substrate: 96% alumina
- Die and wire bonding
- Hermetic sealing
- Gross and Fine leak of metal packages.
- Bond Pull and die shear strength testing
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EMS and Power supply
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- PCB layout design upto 6 layers.
- Medium power DC-DC & AC-DC converters design
- Design and Development of Automated Test Jigs.
- Wave soldering of boards upto 300 mm x 300 mm board size.
- SMD assembly from 0402 to fine-pitch QFP.
- BGA soldering.
- Manual and Automated Testing of Assembled Boards and Hybrids
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In-house Environmental & Mechanical Testing facility for PCBs,Modules and Hybrid Microcircuits
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Environmental Tests
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- Temperature Cycling (Method 1010)
- Thermal Shock (Method 1011)
- Seal, Fine and Gross Leak Test (Method 1014)
- Burn-In Test (Method 1015)
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Mechanical Tests
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- Constant Acceleration (Method 2001) up to 5000 g
- Solder ability (Method 2003)
- Lead Integrity (Method 2004)
- Bond Strength Destructive Bond Pull Test (Method 2011)
- Resistance to Solvents (Method 2015)
- Physical Dimensions (Method 2016)
- Die Shear Strength (Method 2019)
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VCB also has full fledged facility for screening of HMC’s,passive and DISCRETE COMPONENTS.
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